BCP68T1G ACCESO
| Disponibile |
BCP68T1G ON
Corrente elevata: IC = 1,0 A
The SOT−223 Package Can Be Soldered Using Wave or Reflow
SOT−223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
Il complemento PNP è BCP69T1
AEC−Q101 Qualified and PPAP Capable
Prefisso S per applicazioni automobilistiche e di altro tipo che richiedono requisiti univoci di modifica del sito e del controllo
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant*
Corrente elevata: IC = 1,0 A
The SOT−223 Package Can Be Soldered Using Wave or Reflow
SOT−223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
Il complemento PNP è BCP69T1
AEC−Q101 Qualified and PPAP Capable
Prefisso S per applicazioni automobilistiche e di altro tipo che richiedono requisiti univoci di modifica del sito e del controllo
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant*
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